Advances in Interconnect Technologies: An International Journal(AITIJ)

 Call for papers

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.

Topics of the interests:

Emerging Materials
CNT/ Graphene Interconnects
Modeling and Simulation
Optical Interconnects
Wireless Interconnects
Microstrip Lines
Analog and Mixed Signals
Dedicated Software and Systems for Developing Interconnect Technology
On-Chip and Off-Chip Interconnects
Fabrication Techniques
Neural Networks
Parasitics Issues
Optimization Techniques
Paper Submission

Authors are invited to submit papers for this journal through Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.

Important Dates 

Submission Deadline    : August 05, 2017
Notification                   : September 05, 2017
Final Manuscript Due   : September 15, 2017
Publication Date           : Determined by the Editor-in-Chief
For other details please visit


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